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530745-2

  1. TE Connectivity
  3. Connectors
  5. PCB Connectors_new
  7. Board-To-Board Connectors
  9. Board-To-Board Headers & Receptacles
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HELP_VARIABLE
Company
TE Connectivity
Description
530745-2
Bill of material
530745-2
PN
Part Number
530745-2
CTEPS
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TEINTERNAL
TE Internal #
530745-2
TEINTERNALDESCRIPTION
TE Internal Description
MINI-BOX RCPT ASSY 30P UNSEAL
MILSPEC
Mil-Spec
M55302119-02
PCBCONNECTORASSEMBLYTYPE
PCB Connector Assembly Type
PCB Mount Receptacle
SEALABLE
Sealable
No
CONNECTORCONTACTTERMINATESTO
Connector & Contact Terminates To
Printed Circuit Board
STACKABLE
Stackable
No
NUMBEROFROWS
Number of Rows
2
PCBMOUNTORIENTATION
PCB Mount Orientation
Vertical
NUMBEROFPOSITIONS
Number of Positions
30
POSTSIZE
Post Size
.20 x .46 mm [ .008 x .018 in ]
CONTACTBASEMATERIAL
Contact Base Material
Beryllium Copper
PCBCONTACTTERMINATIONAREAPLATINGMATERIAL
PCB Contact Termination Area Plating Material
Tin-Lead
CONTACTMATINGAREAPLATINGMATERIAL
Contact Mating Area Plating Material
Gold
CONTACTMATINGAREAPLATINGMATERIALTHICKNESSUIN
Contact Mating Area Plating Material Thickness
50 uin
CONTACTTYPE
Contact Type
Socket
CONTACTLAYOUT
Contact Layout
Staggered
TERMINATIONPOSTTAILLENGTHMM
Termination Post & Tail Length
3.56, 4.83 mm
TERMINATIONPOSTTAILLENGTHIN
Termination Post & Tail Length
.14, .19 in
TERMINATIONMETHODTOPRINTEDCIRCUITBOARD
Termination Method to Printed Circuit Board
Through Hole - Solder
MATINGALIGNMENT
Mating Alignment
With
MATINGALIGNMENTTYPE
Mating Alignment Type
Polarized
PCBMOUNTRETENTION
PCB Mount Retention
Without
CENTERLINEPITCH
Centerline
1.27 mm [ .05 in ] Pitch
HOUSINGCOLOR
Housing Color
Gray
HOUSINGMATERIAL
Housing Material
LCP (Liquid Crystal Polymer)
CONNECTORHEIGHT
Connector Height
5.46 mm [ .215 in ]
ROWTOROWSPACING
Row-to-Row Spacing
3.81 mm [ .15 in ]
ASSEMBLYPROCESSFEATURE
Assembly Process Feature
None
PACKAGINGQUANTITY
Packaging Quantity
6
PACKAGINGMETHOD
Packaging Method
Package