5536098-5

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Company	TE Connectivity
Description	5536098-5
Bill of material	5536098-5
PN Part Number	5536098-5
CTEPS Contact TE Product Support	CLICK HERE to Contact TE Product Support
FSCPBN Find Specs, Compatible Parts, or Buy Now	CLICK HERE to Find Specs, Compatible Parts, or Buy Now
TEINTERNAL TE Internal #	5536098-5
TEINTERNALDESCRIPTION TE Internal Description	ASSY,PIN,EURO,TYPE R,LEAD-FREE,A&C,6496
CONNECTORHOUSINGTYPE Connector & Housing Type	Plug
CONNECTORSYSTEM Connector System	Board-to-Board
SEALABLE Sealable	No
CONNECTORCONTACTTERMINATESTO Connector & Contact Terminates To	Printed Circuit Board
DINSIZE DIN Size	Half
DINLEVEL DIN Level	II
MATINGUNMATINGCONFIGURATION Mating & Unmating Configuration	Make First Break Last
NUMBEROFPOSITIONS Number of Positions	64
NUMBEROFROWS Number of Rows	3
PCBMOUNTORIENTATION PCB Mount Orientation	Vertical
NUMBEROFCOLUMNS Number of Columns	32
ROWSLOADED Rows Loaded	A, C
NUMBEROFSIGNALPOSITIONS Number of Signal Positions	64
CONTACTBASEMATERIAL Contact Base Material	Copper Alloy
PCBCONTACTTERMINATIONAREAPLATINGMATERIAL PCB Contact Termination Area Plating Material	Tin
CONTACTTYPE Contact Type	Pin
CONTACTCURRENTRATINGMAXA Contact Current Rating Max	3	A
CONTACTCROSSSECTION Contact Cross Section	.64 x .64 mm [ .025 x .025 in ]
TERMINATIONMETHODTOPRINTEDCIRCUITBOARD Termination Method to Printed Circuit Board	Through Hole - Press-Fit
TERMINATIONPOSTTAILLENGTH Termination Post & Tail Length	5.59 mm [ .22 in ]
PCBMOUNTRETENTIONTYPE PCB Mount Retention Type	ActionCompliant Tail
PCBMOUNTRETENTION PCB Mount Retention	With
MATINGALIGNMENT Mating Alignment	Without
CONNECTORMOUNTINGTYPE Connector Mounting Type	Board Mount
HOUSINGMATERIAL Housing Material	Polymer - GF
CENTERLINEPITCH Centerline	2.54 mm [ .1 in ]	Pitch
PCBTHICKNESSRECOMMENDED PCB Thickness	2.36 mm [ .093 in ]	Recommended
ROWTOROWSPACING Row-to-Row Spacing	2.54 mm [ .1 in ]
OPERATINGTEMPERATURERANGE Operating Temperature Range	-55 - 105 C [ -67 - 221 F ]
CIRCUITAPPLICATION Circuit Application	Signal
PACKAGINGMETHOD Packaging Method	Package

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