피드백을 통해 제안을 제출하거나 온라인 고객 서비스에 문의할 수 있습니다. 신속하게 개선하겠습니다.:
지원
확인
??
지원되는 타사 쿠키 없음
귀하의 브라우저는 타사 쿠키 설정을 허용하지 않습니다. 브라우저 설정에서 활성화하거나 아래 버튼을 클릭하십시오.
새 탭에서 페이지 내용을 열려면 여기를 클릭하십시오.
열려 있는 페이지가 처음에 작동하지 않는 경우 페이지를 다시 로드해 보십시오.
파트커뮤니티가 작동하려면 브라우저에서 쿠키를 활성화하십시오.
카탈로그 탐색
언어선택:
English
English
1658051-3
TE Connectivity
Connectors
PCB Connectors_new
Board-To-Board Connectors
Board-To-Board Headers & Receptacles
Powered by
CAD모델 다운로드
CAD 파일 생성
PDF 데이터시트 생성
미리보기
3D
2D
CAD모델 선택
{teconnectivity/connectors/pcb_connectors_new/board_to_board_connectors/board_to_board_headers_and_receptacles/1658051_3.prj},{NB=1658051-3},{PN=1658051-3},{NUMBEROFROWS=2},{NUMBEROFPOSITIONS=120},{OPERATINGVOLTAGEVAC=125},{IMPEDANCEOHM=100},{INSULATIONRESISTANCEMOHM=2},{DIELECTRICWITHSTANDINGVOLTAGEMAXVAC=675},{PACKAGINGQUANTITY=24},{SHA256=5CQMUJ83GB4F3KzxuWBRTOKW4CgvN2bMMZVvgMiGEpM=},{INAME=16580512d3},{CTEPS=CLICK HERE to Contact TE Product Support},{FSCPBN=CLICK HERE to Find Specs, Compatible Parts, or Buy Now},{LINKCTEPS=http://www.te.com/usa-en/about-te/connected-world/customer-support.html?te_bu=Cor&te_type=disp&te_campaign=cdn_glo_cor-cdn-global-disp-prtnr-fy19-cdn-cust-supt-link_sma-300_7&elqCampaignId=35242}
기술적 기준에 따라 원하는 제품을 선택하십시오. 선택할 수 있는 속성은 테이블 아이콘으로 표시됩니다. 선택은 테이블의 아이콘이나 값에 따라 재설정 됩니다.
사용 가능한 제품: 1
HELP_VARIABLE
Company
TE Connectivity
Description
1658051-3
Bill of material
1658051-3
PN
Part Number
1658051-3
CTEPS
Contact TE Product Support
CLICK HERE to Contact TE Product Support
FSCPBN
Find Specs, Compatible Parts, or Buy Now
CLICK HERE to Find Specs, Compatible Parts, or Buy Now
TEINTERNAL
TE Internal #
1658051-3
TEINTERNALDESCRIPTION
TE Internal Description
MSB0.80PL30ASY120FL,-,F,-TY
PCBCONNECTORASSEMBLYTYPE
PCB Connector Assembly Type
PCB Mount Header
CONNECTORSYSTEM
Connector System
Board-to-Board
HEADERTYPE
Header Type
Standard
SEALABLE
Sealable
No
CONNECTORCONTACTTERMINATESTO
Connector & Contact Terminates To
Printed Circuit Board
CONNECTORCONTACTLOADCONDITION
Connector Contact Load Condition
Fully Loaded
STACKABLE
Stackable
No
NUMBEROFROWS
Number of Rows
2
PCBMOUNTORIENTATION
PCB Mount Orientation
Vertical
NUMBEROFPOSITIONS
Number of Positions
120
BOARDTOBOARDCONFIGURATION
Board-to-Board Configuration
Mezzanine
OPERATINGVOLTAGEVAC
Operating Voltage
125
VAC
IMPEDANCEOHM
Impedance
100
Ohm
INSULATIONRESISTANCEMOHM
Insulation Resistance
2
MOhm
DIELECTRICWITHSTANDINGVOLTAGEMAXVAC
Dielectric Withstanding Voltage Max
675
VAC
CONTACTBASEMATERIAL
Contact Base Material
Phosphor Bronze
PCBCONTACTTERMINATIONAREAPLATINGMATERIAL
PCB Contact Termination Area Plating Material
Gold
CONTACTSHAPEFORM
Contact Shape & Form
Single Beam, Square
CONTACTMATINGAREAPLATINGMATERIAL
Contact Mating Area Plating Material
Select Gold Flash
CONTACTMATINGAREAPLATINGMATERIALTHICKNESS
Contact Mating Area Plating Material Thickness
1.27 um [ 50 uin ]
CONTACTTYPE
Contact Type
Pin
CONTACTCURRENTRATINGMAXA
Contact Current Rating Max
1.25, 9.5
A
TERMINATIONMETHODTOPRINTEDCIRCUITBOARD
Termination Method to Printed Circuit Board
Surface Mount
MATINGRETENTION
Mating Retention
With
MATINGALIGNMENT
Mating Alignment
Without
PCBMOUNTRETENTION
PCB Mount Retention
With
PCBMOUNTALIGNMENT
PCB Mount Alignment
With
CONNECTORMOUNTINGTYPE
Connector Mounting Type
Board Mount
PCBMOUNTALIGNMENTTYPE
PCB Mount Alignment Type
Locating Posts
CENTERLINEPITCH
Centerline
.8 mm [ .031 in ]
Pitch
HOUSINGCOLOR
Housing Color
Black
HOUSINGMATERIAL
Housing Material
LCP (Liquid Crystal Polymer)
CONNECTORHEIGHT
Connector Height
29.24 mm [ 1.149132 in ]
ROWTOROWSPACING
Row-to-Row Spacing
4.73 mm [ .185889 in ]
STACKHEIGHT
Stack Height
30 mm [ 1.181 in ]
PCBTHICKNESSRECOMMENDED
PCB Thickness
.06 mm [ 1.27 in ]
Recommended
OPERATINGTEMPERATURERANGE
Operating Temperature Range
-65 - 125 C [ -85 - 257 F ]
ASSEMBLYPROCESSFEATURE
Assembly Process Feature
None
CIRCUITAPPLICATION
Circuit Application
Power & Signal
ULFLAMMABILITYRATING
UL Flammability Rating
UL 94V-0
PACKAGINGQUANTITY
Packaging Quantity
24
PACKAGINGMETHOD
Packaging Method
Box & Tray, Tray
COMMENT
Comment
Use of stand offs recommended. Contact Product Engineering for recommendations.