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2102159-1

  1. TE Connectivity
  3. Connectors
  5. PCB Connectors
  7. Backplane Connectors
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Company
TE Connectivity
Description
High Speed Backplane Connectors
Bill of material
2102159-1
PN
Part Number
CTEPS
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FSCPBN
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DESC
Description
CS
Connector System
CSTYLE
Connector Style
CSTY
Contact Style
CTYP
Connector Type
SHROUDED
Shrouded
SEALABLE
Sealable
MT
Module Type
CCTT
Connector & Contact Terminates To
PTYP
Product Type
CTT
Contact Transmits (Typical)
MFBL
Make First / Break Last
SA
Signal Arrangement
NSP
Number of Signal Positions
STACKABLE
Stackable
NOP
Number of Pairs
NP
Number of Positions
NR
Number of Rows
NC
Number of Columns
BBC
Board-to-Board Configuration
NPP
Number of Power Positions
GL
Guide Location
CSCMM
Card Slot Centerline
mm
CSCIN
Card Slot Centerline
in
NGP
Number of Ground Positions
NDPC
Number of Differential Pairs per Column
DI
Differential Impedance
Ω
NOSS
Number of Shrouded Sides
DRATE
Data Rate
Gb/s
CPMM
Centerline (Pitch)
mm
CPIN
Centerline (Pitch)
in
EWL
End Wall Location
HC
Housing Color
HM
Housing Material
PT
Post Type
BOARD
Board
PRELOADED
Preloaded
PC
Pairs per Column
ULVRVAC
UL Voltage Rating
VAC
IMPEDANCE
Impedance
Ω
OVVAC
Operating Voltage
VAC
OVVDC
Operating Voltage
VDC
DRS
Data Rate
Gb/s
SPEEDS
Speed
Gb/s
SM
Shield Material
GPS
Guide Pin Style
CMAPTM
Contact Mating Area Plating Thickness
µm
CMAPTIN
Contact Mating Area Plating Thickness
µin
CTAPM
Contact Termination Area Plating Material
CD
Contact Design
CMALMM
Contact Mating Area Length
mm
CMALIN
Contact Mating Area Length
in
PCBCTAPTM
PCB Contact Termination Area Plating Thickness
µm
PCBCTAPTIN
PCB Contact Termination Area Plating Thickness
µin
IT
Interface Type
PCBHDMM
PCB Hole Diameter
mm
PCBHD
PCB Hole Diameter
in
PCBTRMM
PCB Thickness (Recommended)
mm
PCBTRIN
PCB Thickness (Recommended)
in
PCBMO
PCB Mount Orientation
CBM
Contact Base Material
CSF
Contact Shape & Form
PCBCTAPMF
PCB Contact Termination Area Plating Material Finish
PCBCTAPMTMM
PCB Contact Termination Area Plating Material Thickness
µm
PCBCTAPMTIN
PCB Contact Termination Area Plating Material Thickness
µin
PCBCTAPM
PCB Contact Termination Area Plating Material
CUM
Contact Underplating Material
CMAPM
Contact Mating Area Plating Material
CMAPMTMM
Contact Mating Area Plating Material Thickness
µm
CMAPMTIN
Contact Mating Area Plating Material Thickness
µin
CCR
Contact Current Rating (Max)
A
CT
Contact Type
CL
Contact Layout
CLMM
Contact Length
mm
CLIN
Contact Length
in
CWMM
Connector Width
mm
CWIN
Connector Width
in
CONNLMM
Connector Length
mm
CONNLIN
Connector Length
in
CHMM
Connector Height
mm
CHIN
Connector Height
in
RRSMM
Row-to-Row Spacing
mm
RRSIN
Row-to-Row Spacing
in
TPLMM
Termination Post Length
mm
TPLIN
Termination Post Length
in
UMTM
Underplate Material Thickness
µm
UMTIN
Underplate Material Thickness
µin
TT
Termination Type
TMPCB
Termination Method to Printed Circuit Board
TPTLMM
Termination Post & Tail Length
mm
TPTLIN
Termination Post & Tail Length
in
ULFR
UL Flammability Rating
PCBMA
PCB Mount Alignment
PCBMAT
PCB Mount Alignment Type
PCBMRT
PCB Mount Retention Type
PCBMR
PCB Mount Retention
MAT
Mating Alignment Type
CMT
Connector Mounting Type
MR
Mating Retention
MA
Mating Alignment
LENGTHMM
Length
mm
LENGTHIN
Length
in
TLMM
Tail Length
mm
TLIN
Tail Length
in
WIDTHMM
Width
mm
WIDTHIN
Width
in
SHMM
Stack Height
mm
SHIN
Stack Height
in
HEIGHTMM
Height
mm
HEIGHTIN
Height
in
OTRC
Operating Temperature Range
°C
OTRF
Operating Temperature Range
°F
FUW
For Use With
CA
Circuit Application
DR
Durability Rating
Cycles
CSAC
CSA Certified
GH
Guide Hardware
ULFN
UL File Number
ULR
UL Rating
AS
Agency/Standard
PM
Packaging Method
COMMENT
Comment