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QA認證資訊
目錄: Samtec
Created: 17.10.2014
產品目錄的特殊屬性:
利用CADENAS质量管理工具 PARTproject QA进行集中管理
Electronic test run was passed (CAD compatibility assured)
只包含唯一性 -> 完整的ERP-匹配性
Samtec
LPAF-10-03.0-L-04-1-K-TR
Samtec
Connectors
High Speed Board-To-Board
High Density Arrays
SEARAY™ LP
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{samtec/connectors/high_speed_btb/high_density_arrays/searay_lp/lpaf_asmtab.prj},{NB=LPAF-10-03.0-L-04-1-K-TR},{SERIES=LPAF},{POS=10},{LS=03.0},{PLOPT=L},{ROW=04},{ST=1},{PPOPT=-K = Polyamide Film Pad},{TROPT=TR},{PPATH=parts/lpaf_asmtpl.prj}
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可提供的產品: 1
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公司
Samtec
描述
LPAF Series - LPAF Series - (1,27 mm) .050'' High Speed Low Profile Open Pin Field
明細表
LPAF-10-03.0-L-04-1-K-TR
PN
Part Number
LPAF-10-03.0-L-04-1-K-TR
SERIES
Series
LPAF
POS
Number of Positions
-10
-20
-30
-40
Non-standard option - Please contact SAMTEC: -50
-10
-20
-30
-40
Non-standard option - Please contact SAMTEC: -50
LS
Lead Style
-03.0 = 3.0mm
-03.5 = 3.5mm
-03.0 = 3.0mm
-03.5 = 3.5mm
PLOPT
Plating Option
-L = 10 µ" Light Selective Gold in Contact Area, Matte Tin on Tail.
Non-standard option - Please contact SAMTEC: -S = 30 µ" Selective Gold in Contact Area, Matte Tin on Tail.
-L = 10 µ" Light Selective Gold in Contact Area, Matte Tin on Tail.
Non-standard option - Please contact SAMTEC: -S = 30 µ" Selective Gold in Contact Area, Matte Tin on Tail.
ROW
Row Option
-04 = Four Row
-06 = Six Row
-08 = Eight Row
-04 = Four Row
-06 = Six Row
-08 = Eight Row
ST
Solder Type
-1 = 63.0% Tin / 37.0% Lead Crimp Tail
-2 = 95.5% Tin / 3.8% Silver / .7% Copper Crimp Tail
-1 = 63.0% Tin / 37.0% Lead Crimp Tail
-2 = 95.5% Tin / 3.8% Silver / .7% Copper Crimp Tail
PPOPT
Pick and Place Pad
-K = Polyamide Film Pad
TROPT
Packaging Options
-TR = Tape and Reel
-FR = Full Reel Qty. Tape and Reel
-TR = Tape and Reel
-FR = Full Reel Qty. Tape and Reel