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QA認證資訊
目錄: Samtec
Created: 17.10.2014
產品目錄的特殊屬性:
利用CADENAS质量管理工具 PARTproject QA进行集中管理
Electronic test run was passed (CAD compatibility assured)
只包含唯一性 -> 完整的ERP-匹配性
Samtec
LPAM-10-01.0-L-04-1-K-TR
Samtec
Connectors
High Speed Board-To-Board
28+ Gbps Solutions
High speed interconnects that support 28+ Gbps requirements
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{samtec/connectors/high_speed_btb/28_gbps_solutions/28_gbps_solutions_2/lpam_asmtab.prj},{NB=LPAM-10-01.0-L-04-1-K-TR},{SERIES=LPAM},{POS=10},{LS=01.0},{PLOPT=L},{ROW=04},{ST=1},{PPOPT=-K = Polyamide Film Pad},{TROPT=TR},{PPATH=parts/lpam_asmtpl.prj}
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可提供的產品: 1
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公司
Samtec
描述
LPAM Series - LPAM Series - (1,27 mm) .050'' High Speed Low Profile Open Pin Field
明細表
LPAM-10-01.0-L-04-1-K-TR
PN
Part Number
LPAM-10-01.0-L-04-1-K-TR
SERIES
Series
LPAM
POS
Number of Positions
-10
-20
-30
-40
Non-standard option - Please contact SAMTEC: -50
-10
-20
-30
-40
Non-standard option - Please contact SAMTEC: -50
LS
Lead Style
-01.0 = 1.0mm
-01.5 = 1.5mm
-01.0 = 1.0mm
-01.5 = 1.5mm
PLOPT
Plating Option
-L = 10 µ" Light Selective Gold in Contact Area, Matte Tin on Tail.
Non-standard option - Please contact SAMTEC: -S = 30 µ" Selective Gold in Contact Area, Matte Tin on Tail.
-L = 10 µ" Light Selective Gold in Contact Area, Matte Tin on Tail.
Non-standard option - Please contact SAMTEC: -S = 30 µ" Selective Gold in Contact Area, Matte Tin on Tail.
ROW
Row Option
-04 = Four Row
-06 = Six Row
-08 = Eight Row
-04 = Four Row
-06 = Six Row
-08 = Eight Row
ST
Solder Type
-1 = 63.0% Tin / 37.0% Lead Crimp Tail
-2 = 95.5% Tin / 3.8% Silver / .7% Copper Crimp Tail
-1 = 63.0% Tin / 37.0% Lead Crimp Tail
-2 = 95.5% Tin / 3.8% Silver / .7% Copper Crimp Tail
PPOPT
Pick and Place Pad
-K = Polyamide Film Pad
TROPT
Tape and Reel Packaging
-TR = Tape and Reel
-FR = Full Reel Qty. Tape and Reel
-TR = Tape and Reel
-FR = Full Reel Qty. Tape and Reel