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1-1735438-1
TE Connectivity
Connectors
Card & Socket Connectors
Memory Sockets
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{teconnectivity/connectors/card_and_socket_connectors/memory_sockets/mini_dimm_sockets.prj},{NB=1-1735438-1},{PN=1-1735438-1},{NP=244},{NR=2},{NHD=6},{NK=1},{CCR=1},{CMAPTIN=30},{PQ=15},{SHA256=hcuap+g3xYDdXKcfIpb7lNAgk624pT33oHjoPSFERuI=},{INAME=00004__c2d12d17354382d12dd2d3d},{CTEPS=CLICK HERE to Contact TE Product Support},{FSCPBN=CLICK HERE to Find Specs, Compatible Parts, or Buy Now},{LINKCTEPS=http://www.te.com/usa-en/about-te/connected-world/customer-support.html?te_bu=Cor&te_type=disp&te_campaign=cdn_glo_cor-cdn-global-disp-prtnr-fy19-cdn-cust-supt-link_sma-300_7&elqCampaignId=35242 },{LINKFSCPBN=https://www.te.com/usa-en/product-1-1735438-1.html?te_bu=Cor&te_type=disp&te_campaign=cdn_glo_cor-cdn-global-disp-prtnr-fy19-cdn-buy-link_sma-300_3&elqCampaignId=35238}
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사용 가능한 제품: 2
HELP_VARIABLE
Company
TE Connectivity
Description
Mini DIMM Sockets
Bill of material
1-1735438-1
PN
Part Number
1-1735438-1
1-1735438-1
CTEPS
Contact TE Product Support
CLICK HERE to Contact TE Product Support
FSCPBN
Find Specs, Compatible Parts, or Buy Now
CLICK HERE to Find Specs, Compatible Parts, or Buy Now
DESC
Description
MiniDIMM,R/A,1.8V,DDR2,RVS,15Au/AuFl
MiniDIMM,R/A,1.8V,DDR2,RVS,15Au/AuFl
DRAMT
DRAM Type
Double Data Rate (DDR) 3
CS
Connector System
Board-to-Board
RRSMM
Row-to-Row Spacing
8.7
mm
RRSIN
Row-to-Row Spacing
.343
in
CCTT
Connector & Contact Terminates To
Printed Circuit Board
PROFILE
Profile
Standard
PT
Product Type
Socket
CP
Center Post
With
NP
Number of Positions
244
MO
Module Orientation
Right Angle
NR
Number of Rows
2
NHD
Number of Hold-Downs
6
KEYING
Keying
Standard
NK
Number of Keys
1
CK
Center Key
None
DRAMVV
DRAM Voltage
1.5
V
ET
Ejector Type
Standard
HDM
Hold-Down Material
Copper Alloy
RPL
Retention Post Location
None
CPM
Center Post Material
Liquid Crystal Polymer (LCP)
LC
Latch Color
Natural
MKT
Module Key Type
Per JEDEC MO-244, Module Variation AB/BB/CB, Standard Orientation
LM
Latch Material
Liquid Crystal Polymer (LCP)
EL
Ejector Location
Both Ends
EM
Ejector Material
Liquid Crystal Polymer (LCP)
EMC
Ejector Material Color
Natural
CBM
Contact Base Material
Copper Alloy
PCBCTAPM
PCB Contact Termination Area Plating Material
Gold Flash
CUM
Contact Underplating Material
Nickel
CCR
Contact Current Rating (Max)
1
A
ST
Socket Type
Memory Card
CMAPTIN
Contact Mating Area Plating Thickness
30
µin
SS
Socket Style
Mini DIMM
CMAPM
Contact Mating Area Plating Material
Gold
IS
Insertion Style
Direct Insert
PCBMRT
PCB Mount Retention Type
Solder Peg
PCBMR
PCB Mount Retention
With
LP
Locating Posts
With
PCBMS
PCB Mounting Style
Surface Mount
CMT
Connector Mounting Type
Board Mount
CPMM
Centerline (Pitch)
.6
mm
CPIN
Centerline (Pitch)
.024
in
HDPM
Hold-Down Plating Material
Tin
HC
Housing Color
Black
HM
Housing Material
LCP (Liquid Crystal Polymer)
HABMM
Height Above PC Board
9.79
mm
HABIN
Height Above PC Board
.385
in
CRHDMM
Center Retention Hole Diameter
2.5
mm
CRHDIN
Center Retention Hole Diameter
.098
in
OTRC
Operating Temperature Range
-55 – 125
°C
OTRF
Operating Temperature Range
-67 – 257
°F
CA
Circuit Application
Power & Signal
ULFR
UL Flammability Rating
UL 94V-0
PQ
Packaging Quantity
15
PM
Packaging Method
Hard Tray, Tray